Lead-Free Ag3.0 Solder Paste

Alloy composition: Sn99Ag0.3Cu0.7, Sn96.5Ag3.0Cu0.5, Sn99.3Cu0.7, and various other specifications

Powder size specifications: T3, T4, T5, T6 – meeting different fine printing requirements

Viscosity range: Multiple viscosity options available to suit various application scenarios

Product features:

• Excellent printability: no bridging or insufficient solder, suitable for high‑precision components

• High solder joint quality: bright and full solder joints after reflow soldering with high mechanical strength

• Strong stability: long shelf life, stable performance during use

Application fields: Widely used in SMT surface mount and BGA packaging processes