Lead‑Free Solder Bar

Specifications: Solder bar

Alloy composition: Sn99.3Cu0.7, Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, etc.

Melting point: 225–229 °C

Product type: Lead‑free solder bar

Packaging specification: 20 kg/carton

Characteristics: High purity, low melting point, bright solder joints, excellent fluidity, strong oxidation resistance

Product features:

• Low solder loss, effectively reducing production costs; full solder joints with high mechanical strength

• Strong compatibility, suitable for various wave soldering machines and hot dip soldering, good stability

Application fields:

• Widely used in wave soldering, hand dip soldering, and hot dip tinning processes

• Suitable for automated soldering production of various electronic components